| PART |
Description |
Maker |
| 47593-8000 0475938000 |
Back Plate for Desktop Type 1.01mm (.040) Pitch LGA 1366 Processor Socket, Steel
|
Molex Electronics Ltd.
|
| ASMB-310-00A1E ASMB-310IR-00A1E |
Dual LGA 1366 Intel? Xeon? 5500/5600 CEB Server Board with 2 PCIe x16 or 4 PCIe x8, SAS RAID
|
Advantech Co., Ltd.
|
| 68145-1625 |
1.02mm (.040) Pitch Wire-to-Board Header, 1.02mm (.040) Tab Type, Vertical, 16Circuits, Black
|
Molex Electronics Ltd.
|
| 2SB1000 |
LOW FREQUENCY POWER AMPLIFIER Complementary pair 2SD 1366
|
Hitachi,Ltd.
Hitachi Semiconductor
|
| 0681450811 68145-0811 |
2.50mm (.098) Pitch Wire-to-Board Header, 1.02mm (.040) Tab Type, Vertical, 8 Circuits, Black
MOLEX Connector
|
Molex Electronics Ltd.
|
| SST29SF040 SST29SF040-55-4C-NH SST29SF040-55-4C-PH |
From old datasheet system
SST29SF512/010/020/040, SST29VF512/010/020/040 512Kbit/ 1Mbit/ 2Mbit/ 4Mbit (x8) Small-Sector Flash
512 Kbit / 1 Mbit / 2 Mbit / 4 Mbit (x8) Small-Sector Flash
|
SST[Silicon Storage Technology, Inc]
SST[Silicon Storage Technology Inc]
|
| HR12A-10LAA8PCA300A HR12-10R-S HR12-10RA-8SC HR12- |
IND,Wirewound,8.2mH,10 % Tol,10-% Tol HR12系列小型圆形DIN型连接器
HR12 SERIES MINIATURE CIRCULAR DIN TYPE CONNECTOR HR12系列小型圆形DIN型连接器
RES 3.9K-OHM 1% 0.063W 200PPM THK-FILM SMD-0603 TR-7-PA
RES 10-OHM 5% 0.063W 250PPM THK-FILM SMD-0402 TR-7-PA2MM
RES 100K-OHM 1% 0.063W 200PPM THK-FILM SMD-0402 TR-7-PA2MM
DIR-COUPLER 16.8DB 1850-1910MHZ THIN-FILM SMD-0402 LGA-SN90/PB10 T&R
DIR-COUPLER 10.5DB 1429-4953MHZ THIN-FILM SMD-0603 LGA-SN100 T&R
DIR-COUPLER 16.5DB 1429-4953MHZ THIN-FILM SMD-0603 LGA-SN90/PB10 T&R
DIR-COUPLER 17.5DB 925-960MHZ THIN-FILM SMD-0603 LGA-SN90/PB10 T&R
|
HIROSE ELECTRIC Co., Ltd.
http://
Hirose Electric USA, INC.
HIROSE[Hirose Electric]
|
| ATS-57003-C1-R0 |
High Performance LGA Cooling
|
Advanced Thermal Solutions, Inc.
|
| FS28-040 |
FS28-040
|
TRIAD MAGNETICS
|
| 1051427000-17 |
LGA 2011-0 Back Plate Assembly
|
Molex Electronics Ltd.
|
| 01827 01827-2 |
0.040 P.C. PIN SOCKET
|
VICOR[Vicor Corporation]
|
